KLIC:NASDAQ, Kulicke and Soffa Industries, Inc.

KLIC stock overview

Kulicke and Soffa Industries, Inc. (KLIC:NASDAQ) closed at $78.63 on October 16, 2026, down 5.32% on the day. The stock trades 42.1% below its 52-week high of $135.80 and 124.5% above its 52-week low of $35.02. Over the past year, it gained 102.3%. Kulicke and Soffa Industries, Inc. is part of the Technology sector (Semiconductors).

Key figures

Price
$78.63
Day change
-5.32%
Volume
804,361
Average volume
805,021
Market cap
4B+
52-week range
$35.02 – $135.80
50-day average
$87.90
200-day average
$85.08

Performance

5D 1M 3M 6M 1Y
-11.04% -4.02% -21.42% -5.74% +102.34%

Price action over the past year

In 252 trading sessions since October 16, 2025, KLIC closed higher on 149 days (59%). Its best day was February 5, 2026 (+19.27%) and its worst was July 7, 2026 (-11.49%). The stock moved 10% or more in a single session 3 times. It opened at least 5% above the previous day's high 2 times.

Recent signals

KLIC news

About Kulicke and Soffa Industries, Inc.

Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and expendable tools to assemble semiconductor devices. It operates in two segments, Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders to connect very fine wires made of gold, silver alloy, or copper between the bond pads of the semiconductor devices or dies, and the leads on its package; wafer level bonders, which mechanically applies bumps to dies for some variants of the flip chip assembly process; and wedge bonders to connect semiconductor chips for the power packages, power hybrids, and automotive modules. This segment also provides advanced packaging with adaptive machine analytics chip-to-substrate bonders for flip chip and thermo-compression bonding applications; and electronic assembly solutions, as well as spare parts, equipment repair, maintenance and servicing, equipment upgrading, and training services. The Expendable Tools segment offers various expendable tools for a range of semiconductor packaging applications. This segment's products include capillaries for use in ball bonders, as well as gold wire bonding; bonding wedges for use...

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Based on end-of-day data. For information only, not investment advice.